Method of controlling crystallographic orientation in laser-annealed polycrystalline silicon films

ABSTRACT

A method is provided to produce thin polycrystalline films having a single predominant crystal orientation. The method is well suited to the production of films for use in production of thin film transistors (TFTs). A layer of amorphous silicon is deposited over a substrate to a thickness suitable for producing a desired crystal orientation. Lateral-seeded excimer laser annealing (LS-ELA) is used to crystallize the amorphous silicon to form a film with a preferred crystal orientation. The crystallized film is then polished to a desired thickness for subsequent processing.

BACKGROUND OF THE INVENTION

[0001] This invention relates generally to semiconductor technology andmore particularly to the method of forming polycrystalline siliconregions within an amorphous silicon film.

[0002] Polycrystalline silicon is formed by crystallizing amorphoussilicon films. One method of crystallizing amorphous silicon films isExcimer Laser Annealing (ELA). Conventional ELA processes formpolycrystalline films having a random polycrystalline structure. Random,as used here, means that no single crystal orientation is dominant andthat polycrystalline structures consist of a mixture of crystallographicorientations in silicon. These crystallographic orientations in siliconare commonly denoted as <111>, <110>, and <100>, along with theirrespective corollaries, as is well known in the art. Control ofcrystallographic orientation is generally desirable because theelectrical characteristics of a polycrystalline silicon film depend uponthe crystallographic orientation of the film. In addition, theuniformity of the electrical characteristics will improve if themajority of the film has a controllable texture.

[0003] ELA, as well as many other annealing methods, has not provided ameans to control these microstructural characteristics and achieve apredictable and repeatable preferential crystal orientation and filmtexture within an annealed film. It would be desirable to have a methodof producing a more uniform crystallographic orientation within apolycrystalline silicon film. It would also be desirable to be able toselect a desired crystallographic orientation.

SUMMARY OF THE INVENTION

[0004] Accordingly, a method of forming a polycrystalline silicon filmwith a desired predominant crystal orientation is provided. The methodof forming polycrystalline films on a substrate comprises the steps of:providing a substrate, depositing an amorphous silicon film on thesubstrate, annealing the substrate to produce a polycrytstalline filmwith the desired predominant crystal orientation, preferably a <100>crystal orientation, and polishing the polycrystalline film to preparethe film for further processing.

[0005] The substrate can be any material which is compatible with thedeposition of amorphous silicon and excimer laser annealing. For displayapplications, the substrate is preferably a transparent substrate suchas quartz, glass or plastic.

[0006] To achieve a good quality film that is predominantly <100>crystal orientation, the step of depositing the amorphous film shoulddeposit to a thickness of at least approximately 100 nm.

[0007] The step of annealing preferably uses a laterally seeded excimerlaser annealing process. The step of polishing can be accomplished byany means that would not significantly modify the crystal orientation ofthe film, including by chemical mechanical polishing. For someapplications a final film thickness of less than 60 nm is desirable.

[0008] The method of the present invention, produces a preparedsubstrate comprising a polycrystalline film, which has a predominantly<100> crystal orientation, overlying a carrier substrate. The final filmis preferably less than 60 nm thick. For display applications, asdiscussed above, the carrier substrate is preferably a transparentmaterial such as quartz, glass or plastic.

BRIEF DESCRIPTION OF THE DRAWINGS

[0009]FIG. 1 is a schematic cross-sectional view showing an excimerlaser anneal (ELA) apparatus used in connection with the present method.

[0010]FIG. 2 (prior art) is a cross-sectional view showingpolycrystalline film crystallized using an interface-seeded ELA (IS-ELA)process

[0011]FIG. 3 illustrates a step in the process of lateral-seeded ELA(LS-ELA).

[0012]FIG. 4 illustrates a step in the process of lateral-seeded ELA(LS-ELA).

[0013]FIG. 5 illustrates a step in the process of lateral-seeded ELA(LS-ELA).

[0014]FIG. 6 is a scatter plot of crystal orientations for a 35 nm thickfilm.

[0015]FIG. 7 is a scatter plot of crystal orientations for a 45 nm thickfilm.

[0016]FIG. 8 is a scatter plot of crystal orientations for a 75 nm thickfilm.

[0017]FIG. 9 is a scatter plot of crystal orientations for a 100 nmthick film.

[0018]FIG. 10 is a diagram illustrating variation in crystal orientationfor various film thicknesses.

[0019]FIG. 11 is a flowchart of a process of performing the method ofthe present invention.

[0020]FIG. 12 is a cross-sectional view of a substrate duringprocessing.

[0021]FIG. 13 is a cross-sectional view of a substrate duringprocessing.

[0022]FIG. 14 is a cross-sectional view of a substrate duringprocessing.

DETAILED DESCRIPTION OF THE INVENTION

[0023] Referring to FIG. 1 a lateral-seeded excimer laser annealing(LS-ELA) apparatus 10 is shown. LS-ELA apparatus 10 has a laser source12. Laser source 12 includes a laser (not shown) along with optics,including mirrors and lens, which shape a laser beam 14 (shown by dottedlines) and direct it toward a substrate 16, which is supported by astage 17. The laser beam 14 passes through a mask 18 supported by a maskholder 20. The laser beam 14 preferably has an output energy in therange of 0.8 to 1 Joule when the mask 18 is 50 mm×50 mm. Currentlyavailable commercial lasers such as Lambda Steel 1000 can achieve thisoutput. As the power of available lasers increases, the energy of thelaser beam 14 will be able to be higher, and the mask size will be ableto increase as well. After passing through the mask 18, the laser beam14 passes through demagnification optics 22 (shown schematically). Thedemagnification optics 22 reduce the size of the laser beam reducing thesize of any image produced after passing through the mask 18, andsimultaneously increasing the intensity of the optical energy strikingthe substrate 16 at a desired location 24. The demagnification istypically on the order of between 3× and 7× reduction, preferably a 5×reduction, in image size. For a 5× reduction the image of the mask 18striking the surface at the location 24 has 25 times less total areathan the mask, correspondingly increasing the energy density of thelaser beam 14 at the location 24.

[0024] The stage 17 is preferably a precision x-y stage that canaccurately position the substrate 16 under the beam 14. The stage 17 ispreferably capable of motion along the z-axis, enabling it to move upand down to assist in focusing or defocusing the image of the mask 18produced by the laser beam 14 at the location 24. The mask holder 20 isalso capable of x-y movement.

[0025]FIG. 2 illustrates aspects of a prior art ELA process. Thisprocess is sometimes referred to as Interface-Seeded ELA (IS-ELA). Anamorphous silicon film 30 has been deposited over the substrate 16. Alaser pulse is directed at the amorphous silicon film 30, which meltsand crystallizes a region 32. The laser pulse melts a region on theorder of 0.5 mm. Small microcrystalline seeds 34 remain, or form, at theinterface. As the surrounding amorphous silicon crystallizes these seedsaffect the crystal orientation. Since the seeds 34 have a variety ofcrystal orientations, the resulting films will accordingly have a widemix of crystal orientations. This is illustrated by previouslycrystallized region 36. In actuality, since a large number of seedswould be present at the interface, a large number of crystalorientations would form.

[0026]FIGS. 3 through 5 illustrate the steps of Lateral-Seeded ELA(LS-ELA), which is also referred to as Lateral-Growth ELA (LG-ELA) orLateral Crystallization ELA (LC-ELA). Starting with FIG. 3, theamorphous silicon film 30 has been deposited over the substrate 16. Alaser beam pulse has been passed through openings 40 in the mask 18 toform beamlets, which irradiate regions 42 of the amorphous silicon film30. Each beamlet is on the order of 5 microns wide. This isapproximately 100 times narrower than the 0.5 mm used in the prior artIS-ELA process. The small regions 42 are melted and crystallized by thebeamlets produced by the laser pulse passing through the mask.

[0027] After each pulse the mask 18 is advanced by an amount not greaterthan half the lateral crystal growth distance. A subsequent pulse isthen directed at the new area. By advancing the image of the openings 40a small distance, the crystals produced by preceding steps act as seedcrystals for subsequent crystallization of adjacent material. Referringnow to FIG. 4, the irradiated regions 42 have moved slightly. Thepreviously crystallized regions 44 act as the seed crystal for thecrystallization of the irradiated regions 42. By repeating the processof advancing the mask laterally and firing short pulses the crystal iseffectively pulled in the direction of the advancing laser pulses.

[0028]FIG. 5 shows the amorphous silicon film 30 after severaladditional pulses following FIG. 4. The crystals have continued to growin the direction of the masks' movement to form a polycrystallineregion. The mask will preferably advance until each opening 40 reachesthe edge of a polycrystalline region formed by the opening immediatelypreceding it. To crystallize larger regions, the stage 17, which wasdescribed in reference to FIG. 1, can be moved, and the mask 18repositioned, to continue crystallizing the amorphous silicon film 30until a region of the desired size has been crystallized.

[0029] This LS-ELA process produces crystallized regions that are moreuniform, due to the propagation of a first crystallized region bysubsequent laser pulses, as opposed to crystallized regions formed usingmultiple seed crystals at the interface. FIGS. 6 through 9 are plotsthat illustrate the affect of amorphous silicon film thickness on theresulting predominant crystal orientation.

[0030]FIG. 6 is a plot of the distribution of crystal orientation for a30 nm thick deposited amorphous silicon film after LS-ELA processing.FIG. 6 shows that a majority of the crystals are in a 101 region 50. The101 region 50 corresponds to a <110> crystal orientation.

[0031]FIG. 7 is a plot of the distribution of crystal orientation for a45 nm thick deposited amorphous silicon film after LS-ELA processing.FIG. 7 shows that the crystal orientations are spread throughout theorientation plot. This is a less ideal condition for the resulting film.It should be noted that the predominant crystal orientation has shiftedaway from the <110> orientation toward the <100> orientation region 52,which corresponds to 001 on the plot.

[0032]FIG. 8 is a plot of the distribution of crystal orientation for a75 nm thick deposited amorphous silicon film after LS-ELA processing.FIG. 8 shows that the crystal orientation has moved closer to the <100>orientation. However, the crystal orientation is still spread over arelatively wide range of crystal orientations.

[0033]FIG. 9 is a plot of the distribution of crystal orientation for a100 nm thick deposited amorphous silicon film after LS-ELA processing.FIG. 9 shows that the crystal orientation is now predominantly <100> asshown by the <100> region 52.

[0034]FIG. 10 is a diagram illustrating variation in crystal orientationfor various film thicknesses. A first thickness 60, which corresponds toan approximately 35 nm thick film, has a <110> orientation to withinless than 10 degrees. A second film thickness 62, which corresponds toan approximately 45 nm thick film, has a mix of <100> orientation towithin 25 degrees and <101> orientation to within approximately 20degrees. A third film thickness 64, which corresponds to anapproximately 75 nm thick film, has a mix of <100> orientation to withinapproximately 20 degrees and <101> orientation to within approximately15 degrees. A forth film thickness 66, which corresponds to anapproximately 100 nm thick film, has a <100> orientation to withinapproximately 10 degrees. As used herein, the term predominant crystalorientation, or any similar phrase, refers to a material that is withinless than 15 degrees of a desired crystal orientation. Looking at FIG.10, it is apparent that it is possible to produce films withpredominantly <110> orientation, or <100> orientation. <100> orientationis generally preferred for semiconductor processes because of itselectrical properties. Unfortunately, to produce predominantly <100>orientation requires the formation of thicker films than those that areconsidered desirable for the formation of thin film transistors.

[0035] Referring now to FIG. 11, a flow chart of the steps of the methodof the present invention is shown. Step 110 deposits a layer ofamorphous silicon over the substrate. The layer of amorphous siliconshould be thick enough to produce predominantly <100> polycrystallinesilicon following subsequent processing according to the method of thepresent invention. The necessary thickness to produce a predominantly<100> polycrystalline material can be determined without undueexperimentation. Preferably, the layer of amorphous silicon will be atleast approximately 100 nm thick.

[0036] Step 120 performs lateral crystallization using LS-ELA to producea polycrystalline region having a predominantly <100> crystalorientation. A laser beam is used to project an image of the mask ontothe substrate. The laser beam energy is sufficient to cause amorphoussilicon to crystallize. A sequence of laser pulses can be used tocrystallize a region, as described above. The resulting polycrystallinefilm is predominantly <100> crystal orientation, meaning within 15degrees of <100> crystal orientation. Preferably, the crystalorientation is within 10 degrees of <100> crystal orientation.

[0037] Step 130 polishes the crystallized silicon. It is generallypreferable to use thinner layers of silicon for forming thin filmtransistors. Since it is necessary to deposit relatively thick layers ofamorphous silicon in order to produce a predominantly <100> crystalorientation in the resulting polycrystalline film, polishing provides amechanism for producing a film of desired thickness. Polycrystallinefilms are preferably less than 60 nm thick following polishing. Thepolishing is preferably achieved using chemical mechanical polishing(CMP).

[0038]FIGS. 12 through 14 show the film at various stages of processing.FIG. 12 shows the substrate 16 with an overlying amorphous silicon film30. For display applications, the substrate is preferably transparent.Available transparent substrate materials include quartz, glass, andplastic. Although it is not shown, a barrier coat may be used betweenthe substrate and the amorphous silicon as is well known to one ofordinary skill in the art. The amorphous silicon film is preferablythick enough to form a predominantly <100> crystal orientation followingLS-ELA processing. Amorphous silicon films on the order of at leastapproximately 100 nm will produce predominantly <100> crystalorientation. Slightly thinner films may also produce the desired result,without undue experimentation.

[0039]FIG. 13 shows a polycrystalline region 44 following the LS-ELAprocess, which was discussed above. The polycrystalline region 44 ispredominantly <100>. By predominantly <100>, it is meant that theorientation is within 15 degrees of <100> as described above withreference to FIG. 10.

[0040]FIG. 14 shows the polycrystalline region 44 following polishing.CMP is the preferred method of polishing the film, although othersuitable means will be known to one of ordinary skill in the art. Thepolycrystalline region is preferably polished to a thickness of lessthan 60 nm. The substrate with its polycrystalline film is now wellsuited to subsequent IC processes used to form devices.

What is claimed is:
 1. A method of forming polycrystalline films on asubstrate comprising the steps of: a) providing a substrate; b)depositing an amorphous silicon film on the substrate; c) annealing theamorphous silicon film using a lateral crystallization process toproduce a polycrystalline film having a predominantly <100>crystallographic orientation; and d) polishing the polycrystalline filmto prepare the film for further processing.
 2. The method of claim 1,wherein the substrate is transparent.
 3. The method of claim 2, whereinthe substrate is quartz, glass or plastic.
 4. The method of claim 1,wherein the amorphous silicon film is deposited to a thickness of atleast 100 nm.
 5. The method of claim 1, wherein the polycrystalline filmhas a crystallographic orientation within 15 degrees of <100>.
 6. Themethod of claim 1, wherein the polycrystalline film has acrystallographic orientation within 10 degrees of <100>.
 7. The methodof claim 1, wherein the lateral crystallization process comprises asequence of laser pulses projected through a mask having a narrow slitto project a beamlet onto the surface of the amorphous silicon film tocrystallize the amorphous silicon film as the beamlet is advanced overthe surface of the amorphous silicon film between successive laserpulses.
 8. The method of claim 1, wherein the step of polishing isaccomplished using chemical mechanical polishing.
 9. The method of claim1, wherein the step of polishing produces a polycrystalline film that isless than 60 nm thick.
 10. A prepared substrate for forming thin filmtransistors comprising a region of polycrystalline film less than 60 nmthick having a crystallographic orientation that is predominantly <100>overlying a carrier substrate.
 11. The prepared substrate of claim 10,wherein the crystallographic orientation is within 15 degrees of <100>.12. The prepared substrate of claim 10, wherein the crystallographicorientation is within 10 degrees of <100>.
 13. The prepared substrate ofclaim 10, wherein the carrier substrate is quartz, glass or plastic.